[SK Hynix Considers Outsourcing Production of Some HBM Base Dies to Intel] According to a report by Golden Finance, the 'Sci-Tech Innovation Board Daily' on the 31st stated that SK Hynix is considering outsourcing the production of some HBM base dies (Base Die) to Intel in order to reduce its reliance on TSMC's wafer foundry services. This plan is expected to begin with the seventh-generation HBM chips, HBM4E. Analysts pointed out that for HBM4, the base die price from TSMC is 3 to 4 times higher than the core chips produced by SK Hynix using its 10nm-class fifth-generation process. It is anticipated that the cost burden will further increase during the transition to HBM4E. Given the high proportion of long-term supply agreements (LTA) for HBM, the company finds it difficult to immediately pass on the increased foundry costs to product prices. Therefore, it needs to establish a multi-supplier system to enhance its price negotiation capabilities. (Herald)