[SK Hynix Considers Intel as a Supplier for Next-Generation HBM Substrate Chips] BlockBeats News, August 31: According to Citrini analyst Jukan, SK Hynix is working on diversifying the foundry suppliers for substrate chips used in high-bandwidth memory (HBM), which are constructed by vertically stacking multiple memory chips. Reportedly, the company is considering outsourcing the production of some substrate chips for its seventh-generation HBM, known as HBM4E, to Intel's foundries. Until now, SK Hynix has relied entirely on TSMC for outsourcing substrate chip production. This move is seen as an effort to establish a multi-supplier foundry strategy to reduce supply chain dependency on TSMC while enhancing SK Hynix's bargaining power in pricing. According to industry sources on August 31, SK Hynix is advancing a plan where the substrate chips for HBM4E could be jointly manufactured by TSMC and Intel, potentially starting with the HBM4E generation. The market expects the cost burden of substrate chips for HBM4E to increase further. Since HBM products are primarily covered by long-term supply agreements (LTA), SK Hynix faces challenges in immediately passing on higher foundry costs to customers through price increases. Therefore, industry observers believe that if Intel ultimately joins SK Hynix's substrate chip supply chain, the company will gain more options in terms of cost competitiveness and supply stability. [Original Link]