星球日报
星球日报|8月 27, 2026 15:16
[SK Hynix Launches Construction of $4 Billion Advanced Memory Packaging Plant in the U.S.] Odaily Planet Daily reports that SK Hynix has commenced construction of a $4 billion memory center located in Indiana, USA; mass production of next-generation HBM4E chips is set to begin in the second half of 2029 at the Indiana plant. SK Hynix's CEO expects Indiana to become the core production base for high-bandwidth memory (HBM) in the United States.
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