AI High-Performance Computing New Substrate Technology Route Seminar Held in Beijing

DeepTechFlow News, August 18 — According to the China Electronic Information Industry Development Research Institute, on the afternoon of August 14, the "AI High-Performance Computing New Substrate Technology Route Seminar" was held at the CCID Building in Beijing. The event was jointly organized by the Key Laboratory of Artificial Intelligence Scenario Innovation and Intelligent Chip Evaluation of the Ministry of Industry and Information Technology at CCID Research Institute and the Artificial Intelligence Industry Committee. Experts at the seminar unanimously agreed that the current new substrate technology is at an industrialization window period, with major bottlenecks including insufficient coordination across "materials—equipment—process—end products," lack of standards, and the absence of pilot platforms. Key areas such as critical materials, specialized equipment, and advanced packaging may face new challenges due to supply-demand mismatches and supply chain concentration. Additionally, the lack of reliability data and unified testing standards has led to a situation where "material companies are hesitant to invest, and end-product companies are reluctant to adopt." Experts suggested strengthening capacity monitoring and early warning systems, promoting diversified supply chains and backup technologies, establishing cross-sector collaborative mechanisms, and building demonstration application pilot zones. By leveraging scenarios to accelerate domestic substitution, the goal is to create a closed-loop industry chain from laboratories to production lines, and from materials to end products. (Jin10)