[SK Hynix and SanDisk Release First Standard Specification for HBF] According to Deep Tide TechFlow, on August 4, SK Hynix announced that the company, in collaboration with SanDisk, has jointly released the first standard specification for the next-generation storage technology High Bandwidth Flash (HBF). It is reported that this standard specification is the first achievement following SK Hynix's partnership with SanDisk to initiate HBF standardization efforts in August last year and the establishment of an alliance in February this year, taking approximately six months to develop. The specification defines two capacity configurations, utilizing 8-layer and 16-layer NAND chip stacking, supporting a maximum capacity of 512GB. It also sets bandwidth standards across three grades (Grade 1~3), with data transfer capabilities ranging from approximately 0.4TB/s to 3.0TB/s. (Jin10)