TYLsemi Raises $43 Million to Advance AI Chiplet Full-Stack Platform

AI infrastructure chiplet platform company TYLsemi announced the completion of a $43 million early-stage funding round, led by Matter Venture Partners, with participation from Viola Ventures, GHOVC, Egis Technology, and others. The company has launched a standardized chiplet portfolio covering IO interconnects, power management, and memory, while also offering chiplet-based custom XPU design and packaging, as well as integrated supply chain services. They claim this can reduce the time and cost of custom AI chip development from architecture to mass production by up to 50%.