[Samsung Electronics Announces Memorandum of Understanding with Broadcom] According to Golden Finance, on July 25, Samsung Electronics stated that it has signed a memorandum of understanding with Broadcom, covering storage chips, foundry services, and advanced packaging businesses valued at up to $200 billion through 2030. Samsung will collaborate with Broadcom to develop Broadcom's next-generation AI accelerators based on Samsung's HBM technology. Samsung Electronics also announced the provision of 2nm-class foundry processes and advanced packaging solutions.